Advanced Thermal Solutions ATS-HK379-R0 High-Performance Cooler Backing Plate is an optional backing plate that connects CPUs and other high-powered processors to the Ultra-Cool family of high-performance passive and active thermal solutions, including dual-FLOW™ and quadFLOW™. The ATS-HK379-R0 is designed for CPUs, processors, GPUs, AI processors, and FPGAs that fit sockets other than the Intel™ LGA2011 square and LGA2066 (Socket R). This plate comes with an unattached die-cut Formex GK-10 insulator to provide electrical insulation between the board and the backing plate. ATS High-Performance Cooler Backing Plate measures 96mm x 96mm with 70mm x 70mm inner dimensions and is intended for use with 1.57mm thick PCB. The ATS-HK379-R0 easily attaches beneath the PCB for even pressure across the board to prevent cracking or other damage.
Connects CPUs and other processors to the Ultra-Cool family of passive and active thermal solutions, including dual-FLOW and quadFLOW
96mm x 96mm dimensions with 70mm x 70mm inner dimensions
Steel material with unattached Formex GK-10 insulator
7.60mm +0.35/-0.00mm required mounting holes in PCB
Attaches beneath the PCB for even pressure across the board to prevent cracking or other damage
Designed for use with 1.57mm thick PCB
Mechanical attachment is PEM® screws and spring
Advanced Thermal Solutions dualFLOW™/quadFLOW™ CPU Coolers for Servers
Ideal for 1U and 2U applications where space and airflow are restricted.