Broadcom HSMF-Cx Surface-Mount ChipLEDs offer a small form factor and low-package height, making them an ideal solution for applications that have headroom constraints. These include wearables and handheld portable devices. The modules are available with heights ranging from 0.4mm to 1.1mm and in a wide range of bicolor illumination colors as well RGB illumination. An individually addressable pin-out for each color provides design flexibility. Broadcom HSMF-Cx Surface-Mount ChipLEDs provide superior light output performance by utilizing efficient and high-brightness AlInGaP and InGaN LED materials. The HSMF-Cx series is compatible with reflow soldering.
Wide range of bicolor illumination colors and RGB illumination
Small form factor
Low-package height of 0.4mm to 1.1mm
Ideal solution for applications that have headroom constraints
AlInGaP and InGaN LED materials
Superior light output performance
Individually addressable pin-out for each color provides design flexibility