Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules are based on the latest micro-pattern trenches technology. This provides reduced losses and offers a high level of controllability. The chip is specially optimized for industrial drives applications. The modules offer lower static losses, higher power density and softer switching. A significant increase of power density can be obtained by raising the allowed maximum operation temperature up to 175°C in the power module.