MT29GZ5A3BPGGA-53AIT.87K TR

Name: Micron Technology MT29GZ5A3BPGGA-53AIT.87K TR
Brand: Micron
SKU: 340-371580-REEL
Price: 72.76 MYR
Availability: InStock

Mouser No:

340-371580-REEL

Mfr. No:

MT29GZ5A3BPGGA-53AIT.87K TR

Mfr.:

Micron

Description:

Multichip Packages MASSFLASH/LPDDR4 6G

Lifecycle:

Verify Status with Factory:

Lifecycle information is unclear. Obtain a quote to verify the availability of this part number from the manufacturer.

ECAD Model:

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More Information

Learn more about Micron MT29GZ5A3BPGGA-53AIT.87K TR

In Stock: 1,967

Stock:: 1,967 Can Dispatch Immediately

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Factory Lead Time:: 53 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 1967 will be subject to minimum order requirements.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1 Maximum: 1967

Unit Price:

RM-.--

Ext. Price:

RM-.--

Est. Tariff:

Packaging:

Full Reel (Order in multiples of 2000)

Cut Tape

MouseReel™ (+RM30.00)

Pricing (MYR)

Qty.	Unit Price	Ext. Price
Cut Tape / MouseReel™ ^†
	RM72.76	RM72.76
	RM67.60	RM676.00
	RM65.52	RM1,638.00
	RM63.96	RM3,198.00
	RM63.11	RM6,311.00
Full Reel (Order in multiples of 2000)
	RM63.11	RM126,220.00

† A MouseReel™ fee of RM30.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Micron Technology
Product Category:	Multichip Packages
RoHS:
Type:	Multichip Packages
Memory Size:	2 Gbit, 4 Gbit
Package/Case:	BGA-149
Series:	MT29G
Mounting Style:	SMD/SMT
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Brand:	Micron
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	SG
Moisture Sensitive:	Yes
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Product Type:	Multichip Packages
Factory Pack Quantity:	2000
Subcategory:	Memory & Data Storage

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USHTS:: 8542320051
ECCN:: 3A991.b.1.b.1

Multichip Packages

Micron Multichip Packages offer critical features and functions for designs, including high performance, high quality, power efficiency, and wide density ranges. Micron Multichip Packages are housed in small package sizes and are available in industrial temperature ranges.

NAND-Based MCP

Micron NAND-Based MCP minimizes power consumption, maximizes density, and increases speed. The devices offer reliability for space-constrained design needs and can drive designs no matter the application. These fully tested, stackable MCPs and PoPs are available in various packages and technology options. Micron manufactures all of the memory elements, including NAND Flash and mobile LPDRAM.